Trumonytechs products

Water Cooling Plates

Trumonytechs - Prismatic Battery Pack Heat Transfer Microchannel Liquid Cooling Plate

Outline envelope dimensions: 1020mm×800mm×53mm. Component: Extruded profiles + quick coonectors. Material: 3003 aluminum alloy. Connection method: brazing. Heat flow density of single cell: 7840W/m³. Temperature difference between inlet and outlet liquid: 2.5?. Maximum battery cell temperature: 32?.

Trumonytechs - Prismatic Battery Pack Heat Transfer Stamping Liquid Cooling Plate

Outline envelope dimensions: 1700mm×1200mm×35mm. Component: Stamping runners+ quick connector. Material: 3003 alumiunum alloy. Connection method: brazing. Heat flow density of single cell: 9233W/m³. Temperature difference between inlet and outlet liquid: 3?. Maximum battery cell temperature: 29?. When the heat exchange demand is high, we also use stamping + fin design.

Thermal Interface Materials

Trumonytechs - Thermal Conductive Pads

Thermal conductive pads are mainly used to be installed between heat generating electronic components and heat sinks to provide an effective thermal interface environment. It improves the efficiency of heat dissipation between them. Within the thermal interface material industry, silicone thermal pad, also known as thermal conductive silicone film, soft thermal conductive pad, etc., is specifically produced using a gap transfer heat design solution that can fill the gap and complete the heat transfer between the heat generating part and the heat dissipating part.

Trumonytechs - Thermal Conductive Structural Adhesive

Thermal Conductive Structural Adhesive is an adhesive that can withstand large loads, is resistant to aging, fatigue and corrosion, has stable performance over its expected life, and is suitable for bonding structural parts that are subject to strong forces. The existing structural adhesives are mainly composed of three systems, namely polyurethane, epoxy and silicone systems. By adding thermal conductive fillers to the matrix, it becomes a thermal conductive structural adhesive with both bonding properties and thermal conductivity, which is suitable for parts that need both bonding and thermal conductivity.