IceMOS - CSOI Wafers Datasheet

ceMOS Technology is a leading supplier of 100–150mm Cavity Bonded SOI wafers for a large range of MEMS applications. By utilising years of deep silicon trench etch expertise and experience coupled with our advanced wafer bonding technology allow customer cavity expectations to be materialized into innovative products. The IceMOS Cavity Bonded SOI is a pre-etched feature embedded under a silicon membrane. This provides an opportunity for the customer designers to develop more intelligent devices in order to meet the most demanding markets.