Established in 2004, IceMOS Technology is focused on establishing itself as a best-in-class provider of cost effective/high performance Super Junction MOSFETs, MEMS solutions and Advanced Engineering Substrates.

IceMOS has developed an innovative deep trench MEMS Super Junction High Voltage MOSFET that outperforms competing solutions with a much simpler, lower cost process. Super Junction MOSFET applications include:

LED TV drivers and power supplies
Lighting HID and LED ballast
Electric and hybrid cars
Solar inverters
IT hardware: servers, laptops, and tablets

The Company is well-positioned to benefit from many of the trends in clean technology and cloud computing.

IceMOS is a global leader in the development and manufacture of high quality MEMS product substrates as well as advanced engineering substrates based on our wafer bonding technology. Our products include:

Thick Film Silicon on Insulator (SOI)
Silicon – Silicon Direct Bonded Wafers (SiSi)
Double / Multi layer SOI and SiSi
Trench isolation SOI
Cavity SOI
Through Silicon Via Interconnect
Custom Advanced Engineering Substrates

Our core expertise is in Wafer Bonding, Deep Reactive Ion Etch (DRIE) and wafer shaping.

We utilise our expertise in DRIE to offer trench etch and refill services to customers on bulk Si substrates or on SOI. Combining both our SOI and trench etch and refill technology, we offer customers a unique dielectrically isolated substrate preparation service.

SOI material is used widely in applications such as telecommunications products and optical devices, dielectrically isolated integrated circuits, solid state relays and micro machined components for MEMS sensors, actuators and Silicon watch parts for the Swiss luxury watch industry.

IceMOS will work directly with the customer to develop a unique specialized product if this is not already on offer. It is with this, that IceMOS’s product portfolio remains unrivaled.

Encompassing over ten years of expertise, unsurpassed manufacturing skill and the latest developments in technology, IceMOS ensures that each customer receives outstanding service from the point of initial enquiry through to product delivery. Along with offering innovative product development, design and specialized services, the engineering team at IceMOS provides an array of technical support.

The dedicated team offer customers the opportunity to receive tailored solutions and unique services by delivering the latest innovations in the Semiconductor industry.

Awarded the ISO 9001:2015, ISO 14001:2015, and IATF 16949:2016 IceMOS is prided on continual investment in quality procedures. Providing ongoing employee training, IceMOS ensure that each employee is kept up-to-date on the latest technology advancements in high-tech manufacturing.

IceMOS Technology Ltd. Downloads

IceMOS - DSP Wafers Datasheet

IceMOS - SOI Wafers Datasheet

IceMOS - DSOI Wafers Datasheet

IceMOS - CSOI Wafers Datasheet

IceMOS - SiSi Wafers Datasheet