microDICE™ - Wafer Dicing System - Brochure

Cost, quality, and throughput are major factors of success for SiC based devices in the semiconductor industry. 3D-Micromac answers this challenge with its brand-new microDICE™ system. The revolutionary, high-performance microDICE™ laser dicing system brings TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end. The microDICE™ separates wafers, including SiC, into dies with an outstanding edge quality while increasing the yield and the throughput.