Microdice™ Energy Equipment & Supplies

1 equipment items found

microDICE™ - Wafer Dicing System

Manufactured by:3D-Micromac AG based inChemnitz, GERMANY

Cost, quality, and throughput are major factors of success for SiC based devices in the semiconductor industry. 3D-Micromac answers this challenge with its brand-new microDICE™ system. The revolutionary, high-performance microDICE™ laser dicing system brings TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end. The microDICE™ separates ...

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