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UDM Systems, LLC
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UDM - Model AKLC400-SPV -Coolant/Lubricant for Silicon Ingot and Sapphire Wafering/Bricking/Squaring/Cropping

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Application: Diamond Wire Sawing Process: AKLC400 Coolant- lubricant is a biodegradable water based, non-caustic material. Dilution ratio of DI /RO water: Slicing Fluid is 500:1 to 1000:1. Effectively reduces the surface tension of cutting/slicing water solution to about 22.0 to 25.0 mN/m. Increases heat transfer (heat dissipation) therefore reducing thermal stress. Outstanding wetting and rinsing properties.

  • Biodegradable, non-hazardous and hence easily disposable.
  • Biochemical Oxygen Demand (BOD) < 12.0 mg/L (BOD less than 12.0 mg/L).
  • Chemical Oxygen Demand (COD) < 96.0 mg/L (COD less than 96.0 mg/L).
  • Elimination of slurry management.
  • No PEG & SiC hazardous waste management