PCB - Model iNPACK - Cutting Edge Semiconductor and Electronics Assembly

Advanced IC Packaging & Organic Substrates – All-in-One Solutions

We offer organic substrate expertise with high-density line/space width and advanced packaging that allows for a smaller form factor, increased functionality, high thermal conductivity, and improved process stability. System-in-Package (SiP) prototypes, or low/mid volume production, Multi-Chip-Modules (MCM), and more; all compatible with aerospace, defense, medical, and other top industry needs. We specialize in heat dissipation solutions that ensure your projects meet high standards of performance and reliability in the shortest possible time to market.

Advanced Packaging Assembly

Our unique assembly process designs enable you to achieve high-level, customized results with IC packaging solutions tailor-made to your specific applications. Our customers are no longer bound by a specific design process dictated by individual fabricators or semiconductor packaging companies. Instead, we offer you the design freedom to choose from a variety of custom options perfectly aligned with your project needs: Antenna-in-Package, Flip-Chip, QFN package technology, Filter-on-Package, and many more.

Technological Edge

iNPACK are experts in organic substrates and enhanced micro-electronics packaging technologies, with cutting-edge capabilities that deliver complete, comprehensive substrate panel-level manufacturing and engineering support to our customers; in fact, they depend on it. We continuously work to improve interconnections between PCB, Substrate and Semiconductors through advanced technological know-how. Solutions include Organic Substrate materials, IC Substrates, Die Packaging, Multi-Chip-Module (MCM) technology, Chip Packaging and more. Creative solutions and enhanced design flexibility give us the ability to deliver high-speed, thermal and RF pathways that simplify integration processes, that improve overall system reliability. Our common design rules (PCB, Substrate & Packaging) are conveniently located under one roof; providing speedier, high-efficiency services, for your peace of mind.