KosakaLab - Die Bonder for High-Speed, High-Accuracy Semiconductor Processing

Kosaka Laboratory Ltd. offers a high-precision die bonder primarily used in the semiconductor industry, designed to meet the needs of high accuracy and high-speed operations. The TR-100 series is a flexible solution that supports development, prototyping, and mass production by combining modular units. It is capable of handling a wide array of workpieces, demonstrating adaptability across various manufacturing stages. The product line includes specialized equipment like the KFA-11 for LD chip manufacturing and a PD die bonder for precise mounting of PD chips. Additionally, their resin coating device provides advanced capability by injecting resin into packages like LED substrates, using a transport system equipped with an XY stage and loader/unloader for efficient handling. This technology is critical for semiconductor fabrication where precision and speed are paramount.