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Semiconductor Processing Equipment & Supplies
42 equipment items found
Manufactured by:Kosaka Laboratory Ltd. based inChiyoda-ku, JAPAN
Kosaka Laboratory Ltd. offers a high-precision die bonder primarily used in the semiconductor industry, designed to meet the needs of high accuracy and high-speed operations. The TR-100 series is a flexible solution that supports development, prototyping, and mass production by combining modular units. It is capable of handling a wide array of workpieces, demonstrating adaptability across various ...
Manufactured by:SAT Group based inCatania, ITALY
SAT Double Bellows is all Teflon* "No Metal Parts Pump", for ultrapure acids, solvents , D.I. water Industries: Semiconductors, Solar, Photovoltaic, Pharmaceutical, Chemical, Energy, Foods, ...
Manufactured by:3D-Micromac AG based inChemnitz, GERMANY
Cost, quality, and throughput are major factors of success for SiC based devices in the semiconductor industry. 3D-Micromac answers this challenge with its brand-new microDICE™ system. The revolutionary, high-performance microDICE™ laser dicing system brings TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end. The microDICE™ separates ...
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Manufactured by:Aerzener Maschinenfabrik GmbH based inAerzen, GERMANY
Thanks to an innovative screw compressor stage and a highly efficient class IE5 permanent magnet motor, the single-stage, oil-injected compressed air packages in the SI series achieve a very high energy efficiency level - even in partial load operation. This enables significant energy savings in compressed air generation and contributes significantly to economical, resource-saving and sustainable ...
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Manufactured by:Aerzener Maschinenfabrik GmbH based inAerzen, GERMANY
The double-stage air compressors of the DS series compress absolutely oil-free in accordance with ISO 8573-1, class 0 and guarantee outstanding performance in almost all application areas at differential pressures between 5.5 and 10.5 bar. A compact plug-and-play solution for your processes - not just for sensitive scopes of ...
Manufactured by:Highvac Corporation based inColorado Springs, COLORADO (USA)
Highvac offers a wide range of dry pumps from several manufacturers, in addition to custom, hybrid solutions tailor-made to your specific, semiconductor processing tool requirements. Contact us now for more information. ...
Manufactured by:VacSol GmbH based inNotzingen, GERMANY
We provide raw silicon material for custom silicon based components such as structural parts for contamination free handling of semiconductor processes. We supply silicon material according to your requirement in different ...
Distributed by:Silicon Valley Microelectronics, Inc. (SVM) based inSanta Clara, CALIFORNIA (USA)
Test Grade Wafers are high quality wafers which have less comprehensive specifications than a prime grade wafer. These wafers monitor the performance and conditions of a particular semiconductor processing step. The Test Grade Wafer provides a more economical solution for isolated ...
Manufactured by:Douglas Electrical Components based inRandolph, NEW JERSEY (USA)
This simplifies mating and un-mating of electrical connections in hermetically sealed environments such as a UHV testing system or semiconductor processing ...
Manufactured by:Johanson Dielectrics based inCamarillo, ALABAMA (USA)
These MLCCs are available in bulk packaging and come with a comprehensive part number system for easy identification. They are essential in applications requiring high temperature resilience and stability, such as semiconductor processing equipment, and are known for their robust mechanical and electrical ...
Manufactured by:UVFAB Systems, Inc. based inSilicon Valley, CALIFORNIA (USA)
This functionality enhances efficiency and customization for specific user requirements, providing flexibility and precision in semiconductor processing and related ...
Manufactured by:Semicorex Advanced Material Technology Co.,Ltd. based inJiangbei District, CHINA
A silicon carbide cantilever paddle is a specialized component used in furnaces for various thermal processing. It is designed to suspend or support samples or materials within the high-temperature environment of the furnace while allowing for easy access, manipulation, and heat transfer. Recrystallized silicon carbide is chosen as the primary material for the silicon carbide ...
Manufactured by:Douglas Electrical Components based inRandolph, NEW JERSEY (USA)
Our terminal seals are designed for high vacuum and pressure applications, including air conditioning and refrigeration compressors, semiconductor processing equipment, vacuum furnaces, and power distribution equipment. Being hermetically sealed includes moisture-tight and gas-tight connections in low, medium and high pressure environments. StudSeal is available ...
Manufactured by:Johanson Dielectrics based inCamarillo, ALABAMA (USA)
The AC power capacitors also exhibit strong dissipation factor versus AC volts characteristics and stable capacitance versus AC volts under X7R dielectric temp characteristics, making them ideal for a range of industrial, military, aerospace, and semiconductor processing equipment applications. Detailed specifications and ordering information can be referenced ...
Manufactured by:SENTECH Instruments GmbH based inBerlin, GERMANY
SENTECH Instruments GmbH offers advanced Cluster Configurations for Plasma Etching and Deposition, designed to enhance high yield and throughput for semiconductor processing. These systems combine plasma etch and deposition modules with up to two cassette stations, allowing for consistent, high-volume processing of wafers up to 200mm in diameter. ...
Manufactured by:Devonics, Inc. based inSan Diego, CALIFORNIA (USA)
FR3 is a new generation of six-axis cobot product. It's range of applications spans, across industries, such as 3C, semiconductor, metal processing, industrial glueing,retail (coffee food) and more. This innovative solution offers the answer, for intelligent manufacturing and automation ...
Manufactured by:Valtech Corporation based inPottstown, PENNSYLVANIA (USA)
Valtech has supplied VALTRON® temporary bonding adhesive systems, ingot support beams, and formulated detergents for the semiconductor wafer process for nearly 20 years. These products have evolved along with the technology as it has transitioned from annular (ID) slicing to multi-wire saw slicing. Our commitment to meeting our customer’s requirements ...
Manufactured by:Tanaka Precious Metals based inShanghai, CHINA
We provide high quality plating processes in various fields from semiconductor and electronics components to decorative products. Our advantage is our highly-skilled professionals can provide the best solution after adequately understanding the situation in which plating process will be ...
Manufactured by:Valtech Corporation based inPottstown, PENNSYLVANIA (USA)
Valtech manufactures ingot slicing beams for use in fixturing various semiconductor materials in preparation for the wafering process. These substrates can be fully customized to accomodate various ingot diameter and lengths as well as custom designed to meet specific user requirements. The ingot slicing beams are available in a variety of material formulations ...
Manufactured by:Auguste Cryogenics based inKošice, SLOVAKIA
Auguste Cryogenics is proud to be one of the very few certified liquefied hydrogen pressure vessel manufacturers ...