Betelex - FPD Etch/Ash System

Today, to manufacture high-resolution and high-performance displays, the TFT process must become more complex, and higher productivity is required for plasma etch systems. Betelex™ supports up to 5 process chambers and realize significantly higher productivity with smaller footprint and facility cost. Betelex™ can also combine multi-process steps in separated chambers and contribute a sophisticated, up-to-date manufacturing process. Betelex™1800 PICP™ can be applied to etch processes on LTPS (Low-Temperature Poly-Silicon) devices; metal layer (Al, Mo) etch, an insulator layer (SiOx, SiNx) etch, polysilicon layer etch or PR ash.