Large Size Silicon Wafer Cutting Technology

The slicing processing area realizes the adjustable design scheme, matching the slicing processing of silicon rods of different sizes

GCL Technology exclusively develops the "anti-cut and reverse" large-size slicing technology to overcome the technical difficulties of high difficulty in wire cutting of large silicon wafers, poor precision of silicon wafers, and low processing yield

Through the development of key auxiliary materials for large silicon wafers, the cutting efficiency can be improved and the cutting consumption can be reduced.