DuPont Solamet - Passivated Emitter Rear Cells (PERC)

Improved Voc from minimized surface recombination without trade-off in fill factor (FF) at lower firing temperatures. Improved open circuit voltage (Voc) from minimized paste induced rear passivation damage. Better short circuit current (Jsc) from improved fine line capability. Good back surface field (BSF) formation on localized contact. Provides proven module reliability. Demonstrated strong adhesion to passivation layers. Minimized Kirkendall voids. Reliable module performance after climate chamber test. Non fire-through capability. High adhesion with low consumption. Co-fireable with Solamet® front side silver and back side aluminum. Very good local BSF formation with minimum voiding. High adhesion on passivation layer (SiO2/SiNx, Al2O3/SiNx stacks) with no dielectric damage. Fast drying and firing. Low electrical resistivity after firing. Cadmium free*.