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UDM - Model L300 D5 -Semiconductor Dicing Lubricant
FromUDM Systems, LLC
Reduction of both electrostatic build up and sawdust surface contamination are essential in today`s die separation of ultra-thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors). The UDM Systems® L-Series lubricants are specifically designed to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.
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- L Series lubricants are biodegradable, non-corrosive aqueous solution
- Completely water-soluble
- For optimum dicing results, ratio of de-ionized water (DI): L300-01-D5 Series should be between 1000:1 and 1500:1
- Increase heat transfer and reduce thermal stress
- Effectively reduces the surface tension of water
- Outstanding wetting properties and excellent rinseability
- Enhance wafer cut quality
- Increases die yield and reliability, and reduces ESD
- Sodium and Potassium free material
- Extend Blade life by 20% to 30%
- Very mild odor
- Biodegradable, non-hazardous and hence easily disposable