TJNE - Semiconductor Plating DSA System

Product overview: roll-to-roll plating, contact device plating, lead frame plating, electropolishing, selective spot plating, etc.
Product features: It can be selected and customized according to your own needs. The shape of the anode can be customized according to customer requirements.
Highlights: long life, low energy consumption, superior plating uniformity, low comprehensive use cost, and high-cost performance.
Applicable scenarios: Semiconductor component plating: roll-to-roll plating, contact device plating, lead frame plating, electropolishing, selective spot plating, etc.
Application conditions: Electrolyte: acidic/cyanide system, gloss agent & other additives PH: 4-5; temperature 30℃-70℃;
Current density: 250-30000A/m2;
Coating type: mixed precious metal coating anode plating platinum anode, the platinum thickness can be lum-10um, or even thicker.
Product after-sales and service: We provide timely and high-quality new anode manufacturing and old anode recoating services globally.

Semiconductor Plating DSA is a highly efficient and reliable plating system designed for the semiconductor industry.

It provides precise control and invariant plating of colorful accoutrements onto semiconductor substrates, icing high- performance and high- quality products.

It utilizes advanced technology and chemistry to deposit thin layers of essence or other accoutrements onto semiconductor substrates. It's grounded on the principle of electroplating, where an electric current is passed through a result containing the asked material, performing in a deposit of the material onto the substrate. The system consists of colorful factors, including a plating bath, power force, and controlunit.It provides precise control and invariant plating of colorful accoutrements onto semiconductor substrates, icing high- performance and high- quality products.

It offers cutting-edge digital switching technology for demanding semiconductor manufacturing applications that require ultra-precise process control and nanometer-scale tolerances.

The core DSA (Digital Switching Amplifier) enables real-time current tuning needed for super-uniform plating deposition. Advanced anode activation methods accelerate plating speeds. Robust hardware components stand up to rigorous 24/7 production environments.

Intuitive touchscreen interface allows easy monitoring and adjustment of plating parameters. The modular and reconfigurable system can scale up to meet increased production capacity needs.

With thousands of worldwide installations, our Semiconductor Plating solutions have a proven track record satisfying the stringent requirements of leading chipmakers. We have extensive experience tailoring our plating technology for wafer bumping, redistribution layer fabrication, TSV metallization, and other advanced IC packaging and interconnect processes.

• Plating bath: A container filled with the plating solution.

• Power supply: Provides the necessary electric current for the plating process.

• Control unit: Regulates the plating parameters, such as voltage and current, to ensure precise and uniform deposition.

• Electrodes: The anode and cathode used for the plating process.

• Chemicals: Various chemicals are used in the plating bath to control the plating process.