Plasma-Therm products

ETCH

VERSALINE - Semiconductor Processing Systems

The VERSALINE platform from Plasma-Therm is engineered to support a broad spectrum of applications within the specialty semiconductor markets, primarily focusing on etching and deposition processes. With its modular design, VERSALINE allows for flexible substrate handling configurations, making it suitable for both research and development and high-volume production environments. The platform incorporates several advanced technologies, including Ion Beam Etch (IBE), Ion Beam Deposition (IBD), and various types of plasma-enhanced chemical vapor deposition (PECVD). These systems are known for their high uniformity, throughput, and cost-efficiency. The onboard Cortex control system ensures user-friendly operation with features like EndpointWorks for enhanced process control. Versatility is enhanced with options for inductive coupled plasma (ICP), deep silicon etching (DSE), and high-density radical flux (HDRF) technology, catering to diverse semiconductor processing needs from low-damage etching to high-aspect-ratio applications.

Plasma-Therm - Parallel-Plate Reactive Ion Etching Systems

Plasma-Therm's Tegal 900 Series comprises industry-standard parallel-plate reactive ion etching systems designed for descum and noncritical dielectric etching applications. These systems are engineered to deliver high efficiency and reliability, occupying a minimal footprint. They offer flexibility in configuration with both manual and cassette loading options, catering to different manufacturing setups. The systems are part of the Tegal Etch Systems family, renowned for their cassette-to-cassette platforms in volume manufacturing contexts. The Cortex control system enhances user interaction with a stable, efficient interface that boosts productivity. Furthermore, Plasma-Therm extends support for various legacy Tegal products, such as the 901e, 903e, 901g, and 6500 HRe cluster tools, including spare parts and upgrades. This commitment ensures the long-term value and adaptability of their etching solutions.