Tokyo Electron Limited (TEL) products

CLEAN TRACK™ LITHIUS Pro™ AP for 300mm wafer processing system incorporates fundamental concepts from the widely-installed CLEAN TRACK™ ACT™ 12, with increased focus on providing optimized hardware and processes to support advanced packaging, high viscosity, and spin-on hard mask applications. Additionally, this platform integrates the latest transfer system with alignment capability and compact spin modules from our leading edge CLEAN TRACK™ LITHIUS Pro™ Z to improve productivity, reliability, and yield. CLEAN TRACK™ LITHIUS Pro™ AP adopts key innovations from our CLEAN TRACK™ series, contributes to improve productivities and yields on advanced packaging and other key semiconductor operations.

Tactras™ Vigus™ is a highly reliable 300mm plasma etch system that enhances etch process productivity. Scaling at advanced technology nodes makes the etch process more and more crucial. As the solution for etch process challenges, Tactras™ Vigus™ provides customized options for high aspect ratio holes, trench etch, mask and dielectric etch, and BEOL dielectric etch.

Certas LEAGA™ is an environment-friendly, high-throughput gas chemical etch system designed for 300mm wafers to provide surface etch and cleaning without the use of liquids. Its dry processing features watermark-free, unique selectivity performance over various SiO2 films and precise control of interface cleaning. It offers greater flexibility when combined with TEL’s cleaning system. Certas LEAGA™ supports a number of isotropic process requirements for 3D-structure devices with high utilization capability and low cost operation through its plasma-free solution.

TELINDY PLUS™ represents the convergence of demonstrated experience and leading edge thermal processing technology. TELINDY PLUS™ incorporates specialized features originally developed for short TAT (Turn Around Time) on the TELFORMULA™ minibatch system as well as field proven, high productivity design elements from the previous generation TELINDY™ platform. Process performance and productivity have continued to improve and further expanded to ALD applications. New enhancements include improved maintenance access through architectural optimization to further reduce maintenance down time.

Today, to manufacture high-resolution and high-performance displays, the TFT process must become more complex, and higher productivity is required for plasma etch systems. Betelex™ supports up to 5 process chambers and realize significantly higher productivity with smaller footprint and facility cost. Betelex™ can also combine multi-process steps in separated chambers and contribute a sophisticated, up-to-date manufacturing process. Betelex™1800 PICP™ can be applied to etch processes on LTPS (Low-Temperature Poly-Silicon) devices; metal layer (Al, Mo) etch, an insulator layer (SiOx, SiNx) etch, polysilicon layer etch or PR ash.