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3D-Micromac microPRO™ - Model RTP - Selective Laser Annealing System for Semiconductor Applications
From3D-Micromac AG
The microPRO™ RTP, a new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing, combines a state-of-the-art laser optic module with 3D-Micromac’s modular semiconductor wafer manufacturing platform. It provides selective annealing with high repeatability and throughput in a versatile system. The microPRO™ RTP features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional laser wavelengths.
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The microPRO™ RTP can address a wide variety of existing and emerging applications, including:
- Giant magneto resistive (GMR) and tunneling magneto resistive (TMR) sensor manufacturing
- Ohmic contact formation in silicon carbide (SiC) power devices to improve resistance
- Dopant activation for insulated gate bipolar transistors (IGBTs), as well as activation of backside illuminated (BSI) CMOS image sensors and amorphous silicon (a-Si)
microPRO™ RTP offers:
- High precision and repeatability in both X and Y directions
- High selectivity to different substrates and films, with multiple options for laser pulse length, energy and overlap to ensure no damage to the
area surrounding the target site - Very high energy homogeneity
- Precise process monitoring
- Flexibility to handle substrate diameters ranging from 50 mm up to 300 mm